1. Agile Full-Chip Sign-Off in the Post-Moore Era;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26
2. Modelling and Analysis of different types of TSV for Three Dimensional Integrated Circuits;2023 International Conference on Networking and Communications (ICNWC);2023-04-05
3. Application of the Real-Time Hilbert Huang Transform to a Noise Perturbed Buck Converter;DESIGN, CONSTRUCTION, MAINTENANCE;2021-09-19
4. Design and Analysis of Power Supply Networks;Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology;2016-04-14
5. Layout Tools for Analog Integrated Circuits and Mixed-Signal Systems-on-Chip: A Survey;Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology;2016-04-14