Theoretical Modelling of Subsurface Damage in Ultra-Precision Grinding of Fused Silica
Author:
Affiliation:
1. The Hong Kong Polytechnic University,State Key Laboratory of Ultra-precision Machining Technology,Department of Industrial and Systems Engineering,Hong Kong,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10119459/10119460/10119504.pdf?arnumber=10119504
Reference15 articles.
1. A review of grinding technologies for glass machining
2. Material removal mechanisms from grinding to polishing;lambropoulos;Ceram Trans,1999
3. Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes
4. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials
5. The critical conditions of brittle–ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding
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