Digital Twin-Based Lifetime Estimation of SiC Power Modules
Author:
Affiliation:
1. TU Chemnitz, Zentrum für Mikrotechnologien (ZfM),Chemnitz,Germany
2. Fraunhofer ENAS, Micro Materials Center, Chemnitz,Chemnitz,Germany
3. Chemnitz University of Technology,Chair of Power Electronics,Chemnitz,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10579539/10579462/10579562.pdf?arnumber=10579562
Reference15 articles.
1. Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling
2. Investigation of reliability issues in sintered silver interconnected power devices and its lifetime prediction by FEM and experiment;Anu,2022
3. Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling
4. Solder Joint Fatigue Life Model;Darveaux,1997
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