Analysis of IGBT Reliability Considering Bonding Line Fault-Reference-Cited by-同舟云学术

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Analysis of IGBT Reliability Considering Bonding Line Fault

Published:2023-08 Issue: Volume: Page:
ISSN:
Container-title:2023 3rd Power System and Green Energy Conference (PSGEC)
language:
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Author:

Wang Yachen¹,Liang Dingkang²,Liu Wei³,Yu Zilong²,Han Yansong²,Lan Xiaomin²

Affiliation:

1. College of Electrical and Power Engineering, Taiyuan University of Technology,CityTaiyuan,China

2. College of Electrial and Power Engineering, Taiyuan University of Technology,CityTaiyuan,China

3. GOLDWIND SCIENCE&TECHNOLOGY CO., LTD.,Urumqi,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10255721/10255807/10255817.pdf?arnumber=10255817

Reference10 articles.

1. Operating IGBTs above rated junction temperature limits: Impacts to reliability and electrical performance

2. Reliability assessment of IGBT modules modeled as systems with correlated components

3. Stress analysis of automotive IGBT module under vibration load

4. Power quality aspects in a wind power plant

5. An Overview on Development of Wind Power Generation

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1. Digital-Twin-Driven Intelligent Insulated-Gate Bipolar Transistor Production Lines;Sensors;2024-01-18

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