Author:
Ming-Hsien Cheng ,Yun-Ju Tung ,Daniel Ying-Tso Lai ,Chia-Nan Pai
Cited by
6 articles.
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1. Mitigate Package Level Crosstalk Using Tabbed Design;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. Crosstalk Reduction in Coupled Microstrip Lines using Interdigital Split on Reference Plane;2023 7th International Electromagnetic Compatibility Conference (EMC Turkiye);2023-09-17
3. Crosstalk Reduction in Coupled Microstrip Lines using TT-shaped DMS Approach;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23
4. Crosstalk reduction between microstrip lines using TL‐shaped defected microstrip structure;Engineering Reports;2022-07-31
5. Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields;2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2021-10-17