Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Cited by
74 articles.
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1. Design of power cycling for reliability testing of LED systems: Numerical and analytical approach;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip;Applied Thermal Engineering;2023-02
4. Determining the Contribution of Spatial Sub-Regions to Structure Functions;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28
5. Defect Detection in Double-Sided Cooled Power Modules by Structure Functions;2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME);2022-06-12