EMI Reduction in Multilayer PCBs Using Planar Interdigital Slot Structures on the Reference Planes-Reference-Cited by-同舟云学术

EMI Reduction in Multilayer PCBs Using Planar Interdigital Slot Structures on the Reference Planes

Published:2022-08-26 Issue: Volume: Page:
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Container-title:2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE)
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Author:

Baghel Lalit Kumar¹,Ahmet Sis Seyit²,Ustuner Fatih³,Kumar Suman¹

Affiliation:

1. Indian Institute of Technology,Department of Electrical Engineering,Ropar Ropar,India

2. Balikesir University,Department of Electrical and Electronics Engineering,Balikesir,Balikesir,Turkey

3. Istanbul Commerce University,Department of Electrical and Electronics Engineering,Istanbul,Istanbul,Turkey

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9935102/9935149/09935171.pdf?arnumber=9935171

Reference22 articles.

1. Ac coupling of power plane sections using improved capacitance stitching material;lentschke;uS Patent 7 361 843,2008

2. Plane splits filled with lossy materials;chen;uS Patent 6 706 974,2004

3. Defected ground structure to minimize emi radiation;bois;uS Patent 10 178 761,2019

4. Analysis and design of defected ground structure for EMC improvement in mixed‐signal transceiver modules

5. Microstrip defected ground structures without radiation loss using multilayer pcb technology;coonrod;PCB Fabrication and Material Considerations for the Different Bands of 5G,2018

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1. Crosstalk Reduction in Coupled Microstrip Lines using Interdigital Split on Reference Plane;2023 7th International Electromagnetic Compatibility Conference (EMC Turkiye);2023-09-17

2. Crosstalk Reduction in Coupled Microstrip Lines using TT-shaped DMS Approach;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23