Impact of Immersion Cooling on Balancing Semiconductor Thermal Distribution in NPC Multilevel Converters for Transportation Propulsion-Reference-Cited by-同舟云学术

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Impact of Immersion Cooling on Balancing Semiconductor Thermal Distribution in NPC Multilevel Converters for Transportation Propulsion

Published:2023-10-29 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE Energy Conversion Congress and Exposition (ECCE)
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Author:

Ilka Reza¹,Wang Yiju¹,He JiangBiao¹,Ren Ning²,Zhang Z. George²,Wu Gefei²,England Roger²

Affiliation:

1. University of Kentucky,Lexington,KY,USA

2. Valvoline Global Operations,Lexington,KY,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10361838/10361943/10362768.pdf?arnumber=10362768

Reference15 articles.

1. Aircraft Distributed Electric Propulsion Technologies—A Review

2. Toward more electric powertrains in aircraft: Technical challenges and advancements

3. Water immersion cooling of high power density electronics

4. A Megawatt-Scale Medium-Voltage High-Efficiency High Power Density “SiC+Si” Hybrid Three-Level ANPC Inverter for Aircraft Hybrid-Electric Propulsion Systems

5. Research and Realization of High-Power Medium-Voltage Active Rectifier Concepts for Future Hybrid-Electric Aircraft Generation

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-Physics Modeling of Power Electronic Converters with Liquid Immersion Cooling;2023 IEEE Energy Conversion Congress and Exposition (ECCE);2023-10-29

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