Power Electronic Substrates for Space Restricted Application
Author:
Affiliation:
1. Oak Ridge National Laboratory,Power Electronics and Electric Machinery Group,Oak Ridge,TN,37831
Funder
Office of Energy
Vehicle Technologies Office
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10361838/10361943/10362265.pdf?arnumber=10362265
Reference18 articles.
1. DBC substrate in Si- and SiC-based power electronics modules: Design, fabrication and failure analysis
2. Thermal Management and Electromagnetic Analysis for GaN Devices Packaging on DBC Substrate
3. Advanced DBC (direct bonded copper) substrates for high power and high voltage electronics
4. Nonconchoidal Fracture in Power Electronics Substrates due to Delamination in Baseplate Solder Joints
5. How TIM impacts thermal performance of electronics: : A thermal point of view study to understand impact of Thermal Interface Material (TIM)
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