Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices-Reference-Cited by-同舟云学术

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Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Boyer Nicolas,Janta-Polczynski Alexander,Morissette Jean-Francois,Kamlapurkar Swetha,Engelmann Sebastian,Taira Yoichi,Takenobu Shotaro,Numata Hidetoshi,Fortier Paul,Barwicz Tymon

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545738.pdf?arnumber=7545738

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicon photonic co-packaging: Adhesive dispense challenge and control;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. Net 67 Gbps Transmission Over 2 km at Sub 1 Vpp Using Packaged Silicon Photonic MZM;IEEE Photonics Technology Letters;2022-11-01

3. Advances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides;IEEE Journal of Selected Topics in Quantum Electronics;2020-03

4. Self-Aligned Polymeric Fiber Interface with 20/mm Port Density and 1.1 dB O-Band Loss;2020

5. Automated, high-throughput photonic packaging;Optical Fiber Technology;2018-08

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