Author:
Cadacio Francisco,Wang Teng,Salahouelhadj Abdellah,Capuz Giovanni,Potoms Goedele,Rebibis Kenneth June,Beyer Gerald,Beyne Eric,Gal Wilfred,Zijl Jurrian,Kersjes Sebastiaan,Wensink Henk
Cited by
2 articles.
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1. Same size mold chase technology for effective stack die architectures;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06