Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Author:

Lau John,Li Ming,Tian Dewen,Fan Nelson,Kuah Eric,Kai Wu,Li Margie,Hao J.,Cheung Ken,Li Zhang,Tan Kim Hwee,Beica Rozalia,Ko Cheng-Ta,Chen Yu-Hua,Lim Sze Pei,Lee Ning Cheng,Wee Koh Sau,Ran Jiang,Xi Cao

Publisher

IEEE

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