Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules-Reference-Cited by-同舟云学术

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Fabrication and Integration of Ultrathin, High-Density, High-Frequency Ta Capacitors on Silicon for Power Modules

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Chakraborti Parthasarathi,Neuhart Nathan,Rataj Kamil-Paul,Schnitter Christoph,Gandhi Saumya,Sharma Himani,Raj P. M.,Stepniak Frank,Romig Matt,Lollis Naomi,Tummala Rao R.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545691.pdf?arnumber=7545691

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Ultra‐Thin, Ultra‐High Capacitance Density Tantalum Capacitor for 3D Packaging;Advanced Materials Technologies;2023-03-21

2. On-Device Learning in Memristor Spiking Neural Networks;2018 IEEE International Symposium on Circuits and Systems (ISCAS);2018-05

3. System Scaling With Nanostructured Power and RF Components;Proceedings of the IEEE;2017-12

4. Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties;Journal of Materials Science: Materials in Electronics;2017-09-09

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