Temporary Bonding and Debonding Technologies for Fan-Out Wafer-Level Packaging
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999792.pdf?arnumber=7999792
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The application of Developing Low-warpage Bonding Pair by Finite Element Analysis;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Laser debonding application in ultra-thin device processing;Applied Optics;2023-08-02
3. Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications;Electronics;2023-03-31
4. Optimization of Temporary Carrier Technology for HDFO Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer;Micromachines;2021-03-26
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