Microstructure and Property Changes in Cu/Sn-58Bi/Cu Solder Joints During Thermomigration
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811211.pdf?arnumber=8811211
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study;2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac);2023-06-12
2. A Short Review: Reliability Issues of Lead-Free Sn-Based Alloys for Superconducting Applications;Springer Proceedings in Physics;2023
3. New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints;Materials & Design;2020-07
4. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020
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