Author:
Pu Han-Ping,Kuo H. J.,Liu C. S.,Yu Douglas C. H.
Cited by
24 articles.
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1. Development of New Concept Photo Imageable Dielectric Materials for Next-Generation Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. High Performance 3D Package Technology for Mobile Application Processor (AP);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
4. Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Novel zero side-etch process for <1μm package redistribution layers;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05