Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors-Reference-Cited by-同舟云学术

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Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors

Published:2015-05 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 65th Electronic Components and Technology Conference (ECTC)
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Author:

Gandhi Saumya,Markondeya Raj P.,Chou Bruce C.,Chakraborti Parthasarathi,Kim Min Suk,Sitaraman Srikrishna,Sharma Himani,Sundaram Venky,Tummala Rao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7133058/7159553/07159597.pdf?arnumber=7159597

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-Terminal Low-ESL 3D Silicon Capacitors as Enabler for Optimized and Flat PDN Design;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

2. Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

3. Integrated Very-High-Frequency Switch Mode Power Supplies: Design Considerations;IEEE Journal of Emerging and Selected Topics in Power Electronics;2018-06

4. 3D-IPD with High Aspect Ratio Cu Pillar Inductor;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

5. Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties;Journal of Materials Science: Materials in Electronics;2017-09-09

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