Chip-to-Chip and Chip-to-Wafer Thermocompression Flip Chip Bonding-Reference-Cited by-同舟云学术

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Chip-to-Chip and Chip-to-Wafer Thermocompression Flip Chip Bonding

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Clauberg Horst,Rezvani Alireza,Venkatesan Vinod,Frick Guy,Chylak Bob,Strothmann Tom

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545492.pdf?arnumber=7545492

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review on Hybrid Bonding Interconnection and Its Characterization;IEEE Nanotechnology Magazine;2024-04

2. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Predicting reliability behavior in HBM packages through numerical simulation;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Effectiveness of Slow Cure Non-Conductive Film in Void elimination;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding;IEEE Transactions on Semiconductor Manufacturing;2022-11

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