Author:
You Se-Ho,Jeon Seonghwan,Oh Dan,Kim Kilsoo,Kim Jaechoon,Cha Seung-Yong,Kim GyoungBum
Cited by
45 articles.
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1. Novel Negative-Tone Dry Film Resist and Process for Fine Pitch Copper Wiring with L/S = 1.5/1.5 μm on Build-up Substrate;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Design and Simulation of a System-in-Package Chip for Combined Navigation;Micromachines;2024-01-23
3. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
4. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
5. Dry Film Resist with Four Key Technologies to Achieve L/S=1/1μm Pattern;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05