Development of Mechanical Locking Micro-Anchor Structures for aQFN Package Application-Reference-Cited by-同舟云学术

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Development of Mechanical Locking Micro-Anchor Structures for aQFN Package Application

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Author:

Huang Yu-Lung,Ajayan Mano,Chien Bao-Hui Chang,Lin Wei-Chih

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999987.pdf?arnumber=7999987

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rough Nickel PPF for Mold Adhesion Improvment;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

2. Rough Silver for Improved Lead-Frame Reliability;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26

3. Design Selection and Optimization of Mechanical Anchoring Structure on Pre-plated Cu Leadframes;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

4. Bidens-Inspired Anchor-Locking Microstructure for Improving the Reliability of Advanced Quad Flat No-Lead Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-04

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