Author:
Zhang David C.,Swaminathan Madhavan,Keezer David,Telikepalli Satyanarayana
Cited by
4 articles.
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1. On-Interposer Decoupling Capacitors Placement for Interposer-based 3DIC;2023 24th International Symposium on Quality Electronic Design (ISQED);2023-04-05
2. Low ESL Multi-terminal Capacitor Modeling;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21
3. 2.5D/3D System‐in‐Packaging Integration;Electronic Packaging Science and Technology;2021-12-17
4. Modeling and Analysis of PDN Impedance and Switching Noise in TSV-Based 3-D Integration;IEEE Transactions on Electron Devices;2015-04