High Reliability Solder Resist with Strong Adhesion and High Resolution for High Density Packaging-Reference-Cited by-同舟云学术

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High Reliability Solder Resist with Strong Adhesion and High Resolution for High Density Packaging

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Shimada Sawako,Okada Kazuya,Kudo Tomoya,Ueta Chiho,Suzuki Yuya

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811300.pdf?arnumber=8811300

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermo‐mechanical properties of epoxy composites filled with inorganic particulate fillers for robust solder mask application;Polymer International;2024-05-20

2. Recent developments in advanced polymeric materials for solder mask application: Progress and challenges;Journal of Science: Advanced Materials and Devices;2023-09

3. Enhancing the Interface Adhesion and Reliability Study of High T_g EMC and Substrate for Multichip Package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Reliability in Selective Thinning Technology of Solder Resist for New IC Substrate Architecture;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Investigation of Solder Resist Opening Uniformity on Flip Chip Substrate;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

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