Author:
Arfaei Babak,Mahin-Shirazi Sam,Joshi Shantanu,Anselm Martin,Borgesen Peter,Cotts Eric,Wilcox James,Coyle Richard
Cited by
24 articles.
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1. The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
2. Evolution of the Creep Response of SAC+Bi Lead-Free Solders Subjected to Various Thermal Exposures;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Evolution of the Creep Behavior for SAC305 Lead Free Solder Exposed to Various Thermal Profiles;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05