3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies-Reference-Cited by-同舟云学术

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3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Coudrain P.,Henry D.,Berthelot A.,Charbonnier J.,Verrun S.,Franiatte R.,Bouzaida N.,Cibrario G.,Calmon F.,O'Connor I.,Lacrevaz T.,Fourneaud L.,Flechet B.,Chevrier N.,Farcy A.,Le-Briz O.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575646.pdf?arnumber=6575646

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Test and Design-for-Testability Solutions for Monolithic 3D Integrated Circuits;Proceedings of the 2019 on Great Lakes Symposium on VLSI;2019-05-13

4. Ultra Wide Micro Bumps Interconnection Matrix for High Energy Particle Detection: Process and Assembly;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

5. Permanent Bonding Process Development Using Gapless Glue for CIS-TSV Wafer Level Packaging;2019 China Semiconductor Technology International Conference (CSTIC);2019-03

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