Advanced Wafer Level PKG Solutions for 60GHz WiGig (802.11ad) Telecom Infrastructure-Reference-Cited by-同舟云学术

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Advanced Wafer Level PKG Solutions for 60GHz WiGig (802.11ad) Telecom Infrastructure

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Wu Dapeng,Dahlback Robin,Ojefors Erik,Carlsson Mats,Lim Francis Chee Peng,Lim Yew Kheng,Oo Aung Kyaw,Choi Won Kyung,Yoon Seung Wook

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811191.pdf?arnumber=8811191

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Low-Loss DC-to-300 GHz InP/Si Interconnection Based on Wafer Level Packaging Using Chip-first/Facedown Process;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16

2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

3. 60 GHz RF module with beam-steering optimization algorithm for high data rate access and backhaul communications;EURASIP Journal on Wireless Communications and Networking;2022-09-24

4. Design for the Package-Board Transition and Its Testability Design in the Fan-Out Wafer-Level Package;Electronics;2022-06-20

5. 28 GHz compact dipole antenna array integrated in fan-out eWLB package;International Journal of Microwave and Wireless Technologies;2022-02-21

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