Author:
Theuss Horst,Sigl Alfred,Maier Dominic,Goller Bernd,Vobl Matthias,Herrmann Matthias,Lodermeyer Johannes,Krumbein Ulrich,Dehe Alfons,Geissler Christian,Muehlbauer Franz-Xaver,von Waechter Claus,Kilger Thomas,Wagner Juergen,Fischer Thomas,Bartl Ulf,Helbig Stephan
Cited by
10 articles.
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2. Wafer Level Chip Scale Package Technology Applied to MEMS Pressure Sensor;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Direct-Write 3D Printing of Interconnects for Fan-Out Wafer-Level Packaging;2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS);2022-07-10
5. MEMS Package Design and Technology;Silicon Sensors and Actuators;2022