Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies-Reference-Cited by-同舟云学术

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Direct multichip-to-wafer 3D integration technology using flip-chip self-assembly of NCF-covered known good dies

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Ito Yuka,Murugesan Mariappan,Fukushima Takafumi,Lee Kang-Wook,Choki Koji,Tanaka Tetsu,Koyanagi Mitsumasa

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897434.pdf?arnumber=6897434

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications;2021 IEEE International 3D Systems Integration Conference (3DIC);2021-10

4. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

5. Improvement of Fundamental Technology of 3-D Thermal Compression Bonding With High Accuracy;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-05

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