A new wafer-level packaging technology for MEMS with hermetic micro-environment-Reference-Cited by-同舟云学术

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A new wafer-level packaging technology for MEMS with hermetic micro-environment

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE 61st Electronic Components and Technology Conference (ECTC)
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Author:

Chanchani Rajen,Nordquist Christopher D.,Olsson Roy H.,Peterson Tracy,Shul Randy,Ahlers Catalina,Plut Thomas A.,Patrizi Gary A.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5871442/5898472/05898725.pdf?arnumber=5898725

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-07

2. A Review of Eutectic Au-Ge Solder Joints;Metallurgical and Materials Transactions A;2019-07-22

3. Investigations of silicon wafer bonding utilizing sputtered Al and Sn films;Microsystem Technologies;2016-06-06

4. Design and Fabrication of a Low-cost Wafer-level Packaging for RF Devices;Transactions on Electrical and Electronic Materials;2014-04-25

5. Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding;Journal of Microelectromechanical Systems;2012-12

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