Author:
Ohyama Masaki,Nimura Masatsugu,Mizuno Jun,Shoji Shuichi,Tamura Mamoru,Enomoto Tomoyuki,Shigetou Akitsu
Cited by
12 articles.
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1. Bump-Less Interconnect with Room Temperature Pre-Bondable Adhesive and Solder for High Throughput Chip Stacking;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Study of flip ultrasonic bonding process with Non-conductive paste;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Chiplets: How Small is too Small?;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09
4. Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding;ECS Journal of Solid State Science and Technology;2022-06-01
5. Polymer Direct Bonding Characterization in Wafer Level Packaging for 3D Integration;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21