Author:
Filipovic L.,de Orio R.L.,Selberherr S.,Singulani A.,Roger F.,Minixhofer R.
Cited by
3 articles.
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1. Rough Interface Effect on High-Temperature Reliability of TSV for Electronic Packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Study on the Surface Roughness Improvement for Silicon Samples with Millimeter-Size Openings;2022 IEEE Asia-Pacific Conference on Image Processing, Electronics and Computers (IPEC);2022-04-14
3. Intrinsic stress analysis of tungsten-lined open TSVs;Microelectronics Reliability;2015-08