Funder
Semiconductor Research Corporation-Global Research Collaboration Interconnect and Packaging Sciences Program
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
24 articles.
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1. Fast Decoupling Capacitor Optimization for Power Delivery Network Based on Model and Data Fusion Method;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19
2. Netlist Compaction IR Drop Simulation Flow for Mixed Signal Power Integrity Analysis;2024 Panhellenic Conference on Electronics & Telecommunications (PACET);2024-03-28
3. On-Interposer Decoupling Capacitors Placement for Interposer-based 3DIC;2023 24th International Symposium on Quality Electronic Design (ISQED);2023-04-05
4. A Python Framework for System-on-Chip Power Integrity Simulation;2023 IEEE International Conference on Industrial Technology (ICIT);2023-04-04
5. A Robust Integrated Power Delivery Methodology for 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03