An integrated tailoring model for thermal cycling tests of spacecraft electronics-Reference-Cited by-同舟云学术

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An integrated tailoring model for thermal cycling tests of spacecraft electronics

Published:2016-12 Issue:6 Volume:52 Page:2685-2696
ISSN:0018-9251
Container-title:IEEE Transactions on Aerospace and Electronic Systems
language:
Short-container-title:IEEE Trans. Aerosp. Electron. Syst.

Author:

Ji Xin-Yan,Li Yun-Ze,Wang Jing,Yang Xiao-Ning,Bi Yan-Qiang,Cao Zhi-Song,Li Xi-Yuan,Liu Guo-Qing

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Aerospace Engineering

Link

http://xplorestaging.ieee.org/ielx7/7/7855566/07855576.pdf?arnumber=7855576

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental verification and comparison of different tailoring models for spacecraft electronics thermal cycling tests;Acta Astronautica;2019-06

2. A brief review of ground and flight failures of Chinese spacecraft;Progress in Aerospace Sciences;2019-05

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