1 Tbps on-Chip Multi-dimensional Receiver-Reference-Cited by-同舟云学术

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1 Tbps on-Chip Multi-dimensional Receiver

Published:2023-07-02 Issue: Volume: Page:
ISSN:
Container-title:2023 Opto-Electronics and Communications Conference (OECC)
language:
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Author:

Peng Yingying¹,Cao Hengzhen²,Zhao Weike²,Dai Daoxin¹

Affiliation:

1. Zhejiang University, Zijingang Campus,State Key Laboratory for Modern Optical Instrumentation, College of Optical Science and Engineering, International Research Center for Advanced Photonics,Hangzhou,China,310058

2. Zhejiang University, Zijingang Campus,Key Laboratory for Modern Optical Instrumentation, College of Optical Science and Engineering, International Research Center for Advanced Photonics,Hangzhou,China,310058

Funder

Research and Development

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10209604/10209571/10209830.pdf?arnumber=10209830

Reference10 articles.

1. Space-division multiplexing: the next frontier in optical communication

2. Enhancing optical communications with brand new fibers

3. Multimode silicon photonics

4. Strict non-blocking four-port optical router for mesh photonic network-on-chip

5. Four-channel CWDM transmitter chip based on thin-film lithium niobate platform

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