Author:
Mei James,Naeemi A.,Bakir M.,Murali R.
Cited by
8 articles.
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1. Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects;Chinese Journal of Electronics;2023-11
2. Interconnection Technology Innovations in 2.5D Integrated Electronic Systems;Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies;2019-04-19
3. Through-Silicon Vias: Drivers, Performance, and Innovations;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-07
4. Preface;Design for Manufacturability;2013-08-11
5. Ten Years of Building Broken Chips;ACM Transactions on Embedded Computing Systems;2013-05