8Gb 3D DDR3 DRAM using through-silicon-via technology

Author:

Uksong Kang ,Hoe-Ju Chung ,Seongmoo Heo ,Soon-Hong Ahn ,Hoon Lee ,Soo-Ho Cha ,Jaesung Ahn ,DukMin Kwon ,Jin Ho Kim ,Jae-Wook Lee ,Han-Sung Joo ,Woo-Seop Kim ,Hyun-Kyung Kim ,Eun-Mi Lee ,So-Ra Kim ,Keum-Hee Ma ,Dong-Hyun Jang ,Nam-Seog Kim ,Man-Sik Choi ,Sae-Jang Oh ,Jung-Bae Lee ,Tae-Kyung Jung ,Jei-Hwan Yoo ,Changhyun Kim

Publisher

IEEE

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