11.2 3D ultrasonic fingerprint sensor-on-a-chip-Reference-Cited by-同舟云学术

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11.2 3D ultrasonic fingerprint sensor-on-a-chip

Published:2016-01 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE International Solid-State Circuits Conference (ISSCC)
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Author:

Tang Hao-Yen,Lu Yipeng,Assaderagh Fari,Daneman Mike,Jiang Xiaoyue,Lim Martin,Li Xi,Ng Eldwin,Singhal Utkarsh,Tsai Julius M.,Horsley David A.,Boser Bernhard E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7405163/7417881/7417977.pdf?arnumber=7417977

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 216 × 216 Global-Shutter CMOS Image Sensor With Embedded Analog Memory and Automatic Exposure Control for Under-Display Optical Fingerprint Sensing Applications;IEEE Transactions on Circuits and Systems I: Regular Papers;2023-03

2. High Step-Up Ratio DC-AC Converter Using Fourth-Order LCLC Resonant Circuit for Ultrasonic Fingerprint-Sensor Drivers;Micromachines;2023-02-04

3. An Ultrasound ASIC With Universal Energy Recycling for >7-m All-Weather Metamorphic Robotic Vision;IEEE Journal of Solid-State Circuits;2022-10

4. BatDrone: A 9.83M-focal-points/s 7.76µs-Latency Ultrasound Imaging System with On-Chip Per-Voxel RX Beamfocusing for 7m-Range Drone Applications;2022 IEEE International Solid- State Circuits Conference (ISSCC);2022-02-20

5. A 36V Ultrasonic Driver for Haptic Feedback Using Advanced Charge Recycling Achieving 0.20CV2f Power Consumption;ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC);2021-09-13

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