Author:
Tai Chih-Ming,Liao Chien-Neng
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Cited by
12 articles.
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1. Silicon-Based Integrated RF Filter with 3D Coupled Pole Based on Through-Silicon Via Technology;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13
2. Zero-Pole Optimization of a Novel High-Quality-Factor Planar Helical Resonator;Magnetism;2023-09-28
3. A 3D-Printed Fourth-Order Stacked Filter for Integrated DC-DC Converters;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21
4. Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2021-02
5. High-Performance Compact 3-D Solenoids for RF Applications;IEEE Microwave and Wireless Components Letters;2018-06