Base-plate solder reliability study of IGBT modules for aeronautical application-Reference-Cited by-同舟云学术

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Base-plate solder reliability study of IGBT modules for aeronautical application

Published:2007-09 Issue: Volume: Page:
ISSN:
Container-title:2007 European Conference on Power Electronics and Applications
language:
Short-container-title:

Author:

Lhommeau T.,Martin C.,Karama M.,Meuret R.,Mermet-Guyennet M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4417196/4417197/04417448.pdf?arnumber=4417448

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules;Engineering Failure Analysis;2023-10

2. Temporal and Spatial Differences in Thermal Transfer Behavior of IGBTs Caused by the Baseplate and Die-Attach Solder Cracking;IEEE Journal of Emerging and Selected Topics in Power Electronics;2022-12

3. Failure Mechanism Investigation of Die-Attach Solder Based on the Birth and Death Technology;2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia);2022-05-15

4. Increased Breakdown Voltage and robustness of Embedded power module;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

5. A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation;Microelectronics Reliability;2021-12

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