Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules-Reference-Cited by-同舟云学术

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Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 European Conference on Power Electronics and Applications
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Author:

Bouarroudj M.,Khatir Z.,Ousten J.P.,Dupont L.,Lefebvre S.,Badel F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4417196/4417197/04417457.pdf?arnumber=4417457

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation on Reliability of Power Devices by Finite Element Analysis;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. Thermal Analysis of Power Electronics: Review;Thermal Analysis of Power Electronic Devices Used in Renewable Energy Systems;2017-07-20

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