Contactless Approaches for the Electronic Device Heating during Radiation Hardness Assurance Tests for Single-Event Effects-Reference-Cited by-同舟云学术

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Contactless Approaches for the Electronic Device Heating during Radiation Hardness Assurance Tests for Single-Event Effects

Published:2019-09 Issue: Volume: Page:
ISSN:
Container-title:2019 19th European Conference on Radiation and Its Effects on Components and Systems (RADECS)
language:
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Author:

Nekrasova Ekaterina N.¹,Mitin Eugeniy V.¹,Gromov Pavel Yu.¹,Anashin Vasily S.²

Affiliation:

1. Limited Liability Company NPC Granat,St. Petersburg,Russian Federation

2. United Rocket and Space Corporation - Institute of Space Device Engineering,Branch of Joint Stock Company,Moscow,Russian Federation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9745606/9745637/09745724.pdf?arnumber=9745724

Reference8 articles.

1. Destructive single-event effects in semiconductor devices and ICs

2. Evidence for Lateral Angle Effect on Single-Event Latchup in 65 nm SRAMs

3. Effects of particle energy on proton-induced single-event latchup

4. The effect of temperature on single-particle latchup

5. Research of Noncontact Laser-Based Approach for DUT Heating during Single-Event Effect Tests with Heavy Ion Exposure

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