Behavior of Damaged Sites Introduced by SEGR in Silicon Carbide Power MOSFETs

Author:

Nakada Y.1,Kuboyama S.1,Mizuta E.1,Takeyama A.2,Ohshima T.2,Shindou H.1

Affiliation:

1. Japan Aerospace Exploration Agency, Tsukuba Space Center,Tsukuba,Ibaraki,Japan,305-8505

2. National Institutes for Quantum and Radiological Science and Technology,Takasaki,Gunma,Japan,370-1292

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Comparative Study of Single-Event Effect Tolerance Between Planar and Trench SiC Power MOSFETs;2023 5th International Conference on Radiation Effects of Electronic Devices (ICREED);2023-05-24

2. Radiation damage in GaN/AlGaN and SiC electronic and photonic devices;Journal of Vacuum Science & Technology B;2023-04-19

3. SEEMQTT: Secure End-to-End MQTT-Based Communication for Mobile IoT Systems Using Secret Sharing and Trust Delegation;IEEE Internet of Things Journal;2023-02-15

4. Simulation Study of Single-Event Burnout Reliability for 1.7-kV 4H-SiC VDMOSFET;IEEE Transactions on Device and Materials Reliability;2022-09

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