Development of Build-up Dielectric Material that enables High Temp. Low Loss, High Fracture Toughness Advanced FC-BGA Substrates-Reference-Cited by-同舟云学术

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Development of Build-up Dielectric Material that enables High Temp. Low Loss, High Fracture Toughness Advanced FC-BGA Substrates

Published:2021-12-07 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Hayashi Tatsushi,Chang Pochao,Watanabe Ryoichi,Ichikawa Seiko,Horiki Eita

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663900.pdf?arnumber=9663900

Reference10 articles.

1. Cisco Annual Internet Report (2018-2023);Cisco Systems Inc,2020

2. VNI Complete Forecast Highlights;Cisco Systems Inc,2018

3. Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications

4. Correlation of Dielectric Film Flex Fatigue Resistance and Package Resin Cracking Failure

5. Heterogeneous Integration Technology;bayraktaroglu;AFRL/RYDD Wright Patterson AFB,2017

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