Author:
Stoynova Anna,Bonev Borislav,Andreev Svetozar,Spasova Nina
Reference7 articles.
1. Recent Advances in Active Infrared Thermography for Non-Destructive Testing of Aerospace Components
2. Thermal Analysis of MCM Packaging
3. Survey of thermography in electronics inspection;hsieh;Proceedings of the SPIE Sensing Technology + Applications,2014
4. Microelectronics Failure Analysis
5. Improvement the post-processing quality in lock-in thermography;stoynova;Journal of Circuits Systems and Signal Processing,2019
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献