Microelectronic Encapsulant Material Assessment: A Security Point of View
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663874.pdf?arnumber=9663874
Reference13 articles.
1. Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging
2. Terahertz Based Machine Learning Approach to Integrated Circuit Assurance
3. Counterfeit Integrated Circuits: A Rising Threat in the Global Semiconductor Supply Chain
4. Building Complex Chips That Last Longer;sperling;Semiconductor Engineering,2021
5. Survey of high-temperature polymeric encapsulants for power electronics packaging;yao;IEEE Trans Components Packag Manuf Technol,2015
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Evaluating a Multimodal, Non-Destructive Approach Combining a Resonant Cavity System and Infrared Spectroscopy to Detect Counterfeit and Anomalous Integrated Circuits;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
2. THz-TDS for IC packaging material changes detection under real-world conditions;Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII;2024-03-11
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