Analysis of Signal Integrity in Coupled MWCNT and Comparison with Copper Interconnects
Author:
Affiliation:
1. UCE(A), Osmania Univesity,Dept of ECE,Hyderabad,India
Funder
Osmania University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9725432/9725433/09726011.pdf?arnumber=9726011
Reference15 articles.
1. Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects
2. Modeling and Analysis of Crosstalk Induced Effects in Multiwalled Carbon Nanotube Bundle Interconnects: An ABCD Parameter-Based Approach
3. Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects
4. On the Optimal Design, Performance, and Reliability of Future Carbon Nanotube-Based Interconnect Solutions
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1. Investigation on Bandwidth Enhancement in Copper—Carbon Nanotube Composite Interconnects;2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE);2022-11-18
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