Effective Computational Models for Addressing Asymmetric Warping of Fan-Out Reconstituted Wafer Packaging
Author:
Affiliation:
1. National Cheng - Kung University,Department of Mechanical Engineering,Tainan,Taiwan
2. Advanced Semiconductor Engineering Inc. Group,Group Corporate Research and Development Division,Kaohsiung,Taiwan
Funder
Ministry of Science and Technology
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816725.pdf?arnumber=9816725
Reference13 articles.
1. Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films After Thermal Cycling
2. Mechanical property characterization of sputtered and plasma enhanced chemical deposition (PECVD) silicon nitride films after rapid thermal annealing
3. Thermo-Mechanical Process Emulation and Sensitivity Analysis of Wafer Warpage after Reconstitution in Fan-out Packaging
4. Development of Artificial Neural Network and Topology Reconstruction Schemes for Fan-Out Wafer Warpage Analysis
5. Development of Semi-Analytical Formulation for Asymmetric Warpage Prediction in Fan-Out Reconstitution Process
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2. Post-Buckling Analysis for Addressing Asymmetric Warping of Fan-Out Reconstitution Process;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
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