FOWLP AiP for SOTM Applications
Author:
Affiliation:
1. ASTAR,Institute of Microelectronics (IME),System in Package Dept.,Singapore
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816629.pdf?arnumber=9816629
Reference8 articles.
1. FOWLP RF Passive Circuit Designs for 77GHz MIMO radar applications;sun;2020 Electronics Packaging Technology Conference,2020
2. Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application
3. Dual Polarized FOWLP AiP for 5G Base Station Applications;sun;2021 Electronics Packaging Technology Conference,2021
4. FOWLP AiP Optimization for Automotive Radar Applications;sun;2021 IEEE Electronic Components and Technology Conference,2021
5. A 28-GHz CMOS Direct Conversion Transceiver With Packaged $2 \times 4$ Antenna Array for 5G Cellular System
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Multi-wideband Antenna in Package with Dual Polarizations;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
3. Characterization of FOWLP Antenna in Packages;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
4. Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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