Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate-Reference-Cited by-同舟云学术

Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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Author:

Libsch Frank¹,Mori Hiroyuki²,Gu Xiaoxiong¹

Affiliation:

1. IBM T.J.Watson Research Center,Yorktown Heights,NY,USA

2. IBM Research,Shin-Kawasaki,Japan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816413.pdf?arnumber=9816413

Reference14 articles.

1. Samsung to advance high performance computing systems with launch of industry’s first 3rd-generation (16GB) HBM2E,2020

2. High Bandwidth Memory Interface on Organic Substrate: Challenges to Electrical Design

3. New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D packaging employing next generation High Bandwidth Memory (HBM);kariyazaki;IEEE 2015 International 3D System Integration Conf,0

4. Digital Communications, John Proakis, Massoud Salehi,2007

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