Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus With Sub 0.1 dB/mm Package Insertion Loss
Author:
Affiliation:
1. University of Flordia,Electrical and Computer Engineering,Gainesville,USA
2. Cisco Systems, Inc.,San Jose,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816552.pdf?arnumber=9816552
Reference13 articles.
1. Ultra-High Q-factor Through Fused-silica Via (TFV) Integrated 3D Solenoid Inductor for Millimeter Wave Applications
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4. SoIS- An Ultra Large Size Integrated Substrate Technology Platform for HPC Applications
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1. Metaconductor-Based High Signal Integrity Interconnects for 112 Gbps SerDes Interface with Channel Analysis;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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