A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration-Reference-Cited by-同舟云学术

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A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Imani Roghayeh¹,Chouhan Shailesh¹,Putaala Jussi²,Nousiainen Olli³,Hagberg Juha²,Myllymäki Sami²,Acharya Sarthak⁴,Jantunen Heli²,Delsing Jerker¹

Affiliation:

1. Luleå Technical University,EISLAB,Department of Computer Science, Electrical, & Space Engineering,Luleå,Sweden

2. University of Oulu,Microelectronics Research Unit,Oulu,Finland

3. University of Oulu,Materials and Mechanical Engineering Research Unit,Oulu,Finland

4. University of Oulu,Department of Information Technology and Electrical Engineering,Oulu,Finland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195374.pdf?arnumber=10195374

Reference15 articles.

1. Detailed Characterization of a Fully Additive Covalent Bonded PCB Manufacturing Process (SBU-CBM Method)

2. Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging

3. Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process

4. An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes

5. A Fully Additive Approach for the Fabrication of Split-Ring Resonator Metasurfaces

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advanced Photo-imageable Dielectric Film Enabling Low CTE and sub-5-Micrometer Patterning for Next Generation Build-up Layer;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. A novel fully additive fabrication approach for creating double-stacked copper spiral inductors;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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